Invention Grant
- Patent Title: Light-emitting element and light-emitting device
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Application No.: US17287149Application Date: 2019-10-23
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Publication No.: US12074410B2Publication Date: 2024-08-27
- Inventor: Takahiro Sugiyama , Akiyoshi Watanabe , Hiroki Miyachi , Ryoichi Kashiro , Takeshi Kanzaki
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP 18201039 2018.10.25
- International Application: PCT/JP2019/041568 2019.10.23
- International Announcement: WO2020/085397A 2020.04.30
- Date entered country: 2021-04-21
- Main IPC: H01S5/11
- IPC: H01S5/11 ; H01S5/02 ; H01S5/32

Abstract:
One aspect relates to a light-emitting element having a layer forming a resonance mode. The light-emitting element includes a structure body constituted by a substrate and a semiconductor laminate body including a first cladding layer, a second cladding layer, an active layer, and a resonance-mode forming layer including a basic layer and modified refractive index regions. A laser light output region and a metal electrode film are on opposing surfaces of the structure body. The metal electrode film includes a first layer forming ohmic contact with the structure body, a second layer reflecting light from the resonance-mode forming layer, a third layer, and a fourth layer for solder bonding. The third layer has a different composition from the second layer and the fourth layer, and has a lower diffusion degree than the second layer and the fourth layer to that of a solder material.
Public/Granted literature
- US20210391691A1 LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE Public/Granted day:2021-12-16
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