Invention Grant
- Patent Title: Multidimensional space vector modulation (MDSVM) circuit and method thereof
-
Application No.: US18133295Application Date: 2023-04-11
-
Publication No.: US12074537B2Publication Date: 2024-08-27
- Inventor: Shang Jung Lee , Po-Hsun Yen , Yung-Cheng Chang , Sung-Liang Hou
- Applicant: TENSOR TECH CO., LTD
- Applicant Address: TW New Taipei
- Assignee: TENSOR TECH CO., LTD.
- Current Assignee: TENSOR TECH CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Millen, White, Zelano & Branigan P.C.
- Agent Wan-Ching Montfort
- Priority: TW 1139657 2022.10.19
- Main IPC: H02M7/487
- IPC: H02M7/487 ; H02M7/5387

Abstract:
This patent presents a multidimensional space vector modulation (MDSVM) circuit formed by coupling a half-bridge logic control circuit not directly coupled to electronic components with at least three half-bridge logic control circuits coupled to electronic components. The half-bridge logic control circuit not directly coupled with any electronic components can form a full-bridge circuit with any other half-bridge logic control circuit coupled with electronic components. Therefore, users can further control the voltage difference between both ends of each electronic component separately and then individually control the strength and direction of current flowing through each electronic component and solving the problem of control attributed to the complexity of prior art.
Public/Granted literature
- US20240235420A9 MULTIDIMENSIONAL SPACE VECTOR MODULATION (MDSVM) CIRCUIT AND METHOD THEREOF Public/Granted day:2024-07-11
Information query
IPC分类: