Invention Grant
- Patent Title: Structure and manufacturing method of surface acoustic wave filter with back electrode of piezoelectric layer
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Application No.: US17933070Application Date: 2022-09-16
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Publication No.: US12074586B2Publication Date: 2024-08-27
- Inventor: Guojun Weng , Gongbin Tang
- Applicant: Shenzhen Newsonic Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Shenzhen Newsonic Technologies Co., Ltd.
- Current Assignee: Shenzhen Newsonic Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP.
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H3/08 ; H03H9/02 ; H03H9/05 ; H03H9/10

Abstract:
A surface acoustic wave (SAW) filter includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, the piezoelectric layer having a bottom surface facing the bottom substrate and a top surface opposite to the bottom surface, a lower cavity disposed below the piezoelectric layer, an interdigital transducer (IDT) disposed on the top surface of the piezoelectric layer, and a back electrode disposed on the bottom surface of the piezoelectric layer, and exposed in the lower cavity.
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