Invention Grant
- Patent Title: Method and apparatus for LDPC transmission over a channel bonded link
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Application No.: US18124127Application Date: 2023-03-21
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Publication No.: US12074695B2Publication Date: 2024-08-27
- Inventor: David Barr , Michail Tsatsanis , Arndt Mueller , Na Chen
- Applicant: Entropic Communications, LLC
- Applicant Address: US NY New York
- Assignee: Entropic Communications, LLC
- Current Assignee: Entropic Communications, LLC
- Current Assignee Address: US NY New York
- Agency: Arch & Lake LLP
- The original application number of the division: US14165005 2014.01.27
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H03M13/00 ; H03M13/11 ; H04L1/02 ; H04L5/00 ; H04L12/28 ; H04L25/14 ; H04L47/70 ; H04L27/26
Abstract:
A particular overall architecture for transmission over a bonded channel system consisting of two interconnected MoCA (Multimedia over Coax Alliance) 2.0 SoCs (Systems on a Chip) and a method and apparatus for the case of a “bonded” channel network. With a bonded channel network, the data is divided into two segments, the first of which is transported over a primary channel and the second of which is transported over a secondary channel.
Public/Granted literature
- US20230231647A1 METHOD AND APPARATUS FOR LDPC TRANSMISSION OVER A CHANNEL BONDED LINK Public/Granted day:2023-07-20
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