Invention Grant
- Patent Title: Circuit board producing apparatus
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Application No.: US17583215Application Date: 2022-01-25
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Publication No.: US12075569B2Publication Date: 2024-08-27
- Inventor: Yasuo Matsumura , Sumiaki Yamasaki , Tsuyoshi Murakami , Kana Yoshida , Shuji Sato
- Applicant: FUJIFILM Business Innovation Corp.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 18171873 2018.09.13
- The original application number of the division: US16253226 2019.01.22
- Main IPC: H05K3/12
- IPC: H05K3/12 ; H05K1/02 ; H05K1/18 ; H05K3/02
Abstract:
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Public/Granted literature
- US20220151077A1 CIRCUIT BOARD PRODUCING APPARATUS Public/Granted day:2022-05-12
Information query
