Invention Grant
- Patent Title: Magnetic random access memory and manufacturing method thereof
-
Application No.: US18138625Application Date: 2023-04-24
-
Publication No.: US12075631B2Publication Date: 2024-08-27
- Inventor: Ji-Feng Ying , Duen-Huei Hou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT PC
- Main IPC: H10B61/00
- IPC: H10B61/00 ; B82Y25/00 ; G11C11/16 ; H10N50/01 ; H10N50/10 ; H10N50/80 ; H10N50/85

Abstract:
A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
Public/Granted literature
- US20230269951A1 MAGNETIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-08-24
Information query