Invention Grant
- Patent Title: Conductive particle interconnect switch
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Application No.: US17811374Application Date: 2022-07-08
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Publication No.: US12075702B2Publication Date: 2024-08-27
- Inventor: Matthew Doyle , Joseph Kuczynski , Patrick Egan , Jeffrey N. Judd , Timothy J. Tofil
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: IBM Patents+ Team
- The original application number of the division: US16415949 2019.05.17
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H01H1/029 ; H01H57/00 ; H10N30/20 ; H10N30/857

Abstract:
Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.
Public/Granted literature
- US20220344569A1 CONDUCTIVE PARTICLE INTERCONNECT SWITCH Public/Granted day:2022-10-27
Information query
IPC分类: