Invention Grant
- Patent Title: Semiconductor structure and fabrication method thereof
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Application No.: US17394341Application Date: 2021-08-04
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Publication No.: US12075705B2Publication Date: 2024-08-27
- Inventor: Wen Bin Xia
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN 2010779496.2 2020.08.05
- Main IPC: H10N50/01
- IPC: H10N50/01 ; G01R33/00 ; G01R33/09 ; G11C11/16 ; G11C11/56 ; H10B61/00 ; H10N50/10 ; H10N50/80 ; H10N50/85

Abstract:
A semiconductor structure and a fabrication method thereof. The semiconductor structure, includes: a substrate; and magnetic tunnel junctions on the substrate, that each magnetic tunnel junction of the magnetic tunnel junctions includes a first region and a second region adjacent to the first region, each magnetic tunnel junction includes a multilayered material including material layers stacked along a normal direction of the substrate, and the material layers of each magnetic tunnel junction include at least one material layer that is different in the first region and the second region. The storage capacity density of the semiconductor structure is high.
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