Invention Grant
- Patent Title: System and method for implant delivery
-
Application No.: US17811533Application Date: 2022-07-08
-
Publication No.: US12076261B2Publication Date: 2024-09-03
- Inventor: Cang Lam
- Applicant: Terumo Corporation
- Applicant Address: JP Tokyo
- Assignee: Terumo Corporation
- Current Assignee: Terumo Corporation
- Current Assignee Address: JP Tokyo
- Agency: Inskeep IP Group, Inc.
- Main IPC: A61F2/97
- IPC: A61F2/97 ; A61B17/00 ; A61B17/12 ; A61B17/22 ; A61B90/00 ; A61F2/01 ; A61F2/95 ; A61F2/966
Abstract:
An implant delivery system is described. The implant delivery system utilizes an implant, implant wire, delivery sheath, and a torque device. The torque device may include a cutting element to slit the delivery sheath and a clamp device to fix the position of the implant delivery wire.
Public/Granted literature
- US20220346995A1 System And Method For Implant Delivery Public/Granted day:2022-11-03
Information query
IPC分类:
