Invention Grant
- Patent Title: Resilient body component contact for a subcutaneous device
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Application No.: US18088421Application Date: 2022-12-23
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Publication No.: US12076553B2Publication Date: 2024-09-03
- Inventor: Yatheendhar D. Manicka
- Applicant: Manicka Institute LLC
- Applicant Address: US MN Woodbury
- Assignee: Manicka Institute LLC
- Current Assignee: Manicka Institute LLC
- Current Assignee Address: US MN Woodbury
- Agency: Kinney & Lange, P.A.
- The original application number of the division: US16051451 2018.07.31
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61B5/283 ; A61B5/349 ; A61B17/3211 ; A61M5/142 ; A61N1/372 ; A61N1/375 ; A61N1/39

Abstract:
A subcutaneously implantable device is implantable into a body of a patient, and includes a prong and an electrode. The prong has a contact portion at or adjacent to a distal end thereof that is configured to contact an organ. The prong is constructed to apply pressure to the organ with spring action so as to maintain contact between the contact portion and the organ without fixing the contact portion to the organ. The electrode is provided at the contact portion of the prong, is configured to contact the organ, and is electrically coupled or couplable with circuitry that is configured to provide monitoring, therapeutic, and/or diagnostic capabilities with respect to the organ.
Public/Granted literature
- US12186550B2 Resilient body component contact for a subcutaneous device Public/Granted day:2025-01-07
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