Invention Grant
- Patent Title: Profiling device, profiling method, bonding system, bonding method, and display device
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Application No.: US17682871Application Date: 2022-02-28
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Publication No.: US12076891B2Publication Date: 2024-09-03
- Inventor: Jiafan Shi , Liqiang Chen , Yaming Wang , Dongdong Zhao , Chao Zhou , Yongchun Jiang , Qian Yin
- Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Sichuan
- Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: IPro, PLLC
- Priority: CN 2110266927.X 2021.03.11
- Main IPC: B29C43/02
- IPC: B29C43/02 ; B29C43/52 ; B29C65/32 ; B29C65/78 ; B29C43/32 ; B29L31/34
Abstract:
A profiling device, a profiling method, a bonding system, a bonding method, and a display device are provided. The profiling device includes a profiling jig. The profiling jig includes an attaching surface. The attaching surface is switchable between a planar state and a profiling state, and the attaching surface is a planar surface in the case that the attaching surface is in the planar state, and the attaching surface is a profiling surface in the case that the attaching surface is in the profiling state.
Public/Granted literature
- US20220288819A1 PROFILING DEVICE, PROFILING METHOD, BONDING SYSTEM, BONDING METHOD, AND DISPLAY DEVICE Public/Granted day:2022-09-15
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