Invention Grant
- Patent Title: Three-dimensional shaping device
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Application No.: US17652154Application Date: 2022-02-23
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Publication No.: US12076923B2Publication Date: 2024-09-03
- Inventor: Eiji Okamoto , Toshimitsu Hirai , Kaoru Momose , Takayuki Yokoyama
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: WORKMAN NYDEGGER
- Priority: JP 21031033 2021.02.26
- Main IPC: B29C64/357
- IPC: B29C64/357 ; B29C64/209 ; B29C64/393 ; B33Y30/00 ; B33Y50/02 ; B33Y70/00 ; B29K105/00

Abstract:
A three-dimensional shaping device includes: an ejection head including a nozzle configured to eject a binder containing water, a water-soluble resin, and a wetting agent, an individual liquid chamber communicating with the nozzle, an inflow path configured to flow the binder into the individual liquid chamber, and an outflow path configured to flow the binder out of the individual liquid chamber; and a circulation flow path configured to circulate the binder flowing out of the outflow path to the inflow path.
Public/Granted literature
- US20220274333A1 THREE-DIMENSIONAL SHAPING DEVICE Public/Granted day:2022-09-01
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