Invention Grant
- Patent Title: Dimensional compensations in additive manufacturing
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Application No.: US17417952Application Date: 2019-04-30
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Publication No.: US12076931B2Publication Date: 2024-09-03
- Inventor: Victor Diego Gutierrez , Manuel Freire Garcia , Enrique Gurdiel Gonzalez
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Michael Dryja
- International Application: PCT/US2019/029840 2019.04.30
- International Announcement: WO2020/222789A 2020.11.05
- Date entered country: 2021-06-24
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B22F10/80 ; B33Y10/00 ; B33Y30/00 ; B33Y50/00 ; B33Y50/02 ; B22F10/14 ; B22F10/28 ; B29C64/165 ; B29C64/386

Abstract:
In an example, a method includes receiving, by at least one processor, object model data representing at least a portion of a first object that is to be generated by an additive manufacturing apparatus. An indication of a proportion of the first object which is solid may be determined, and, based thereon, a dimensional compensation value may be determined. The determined dimensional compensation value may be applied to the object model data to determine modified object model data.
Public/Granted literature
- US20220072800A1 DIMENSIONAL COMPENSATIONS IN ADDITIVE MANUFACTURING Public/Granted day:2022-03-10
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