Invention Grant
- Patent Title: Composite material structure and composite material structure producing method
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Application No.: US17352510Application Date: 2021-06-21
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Publication No.: US12076948B2Publication Date: 2024-09-03
- Inventor: Terukazu Kosako
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 20116363 2020.07.06
- Main IPC: B29C70/88
- IPC: B29C70/88 ; C08J5/04 ; H01B1/24 ; H01B3/00 ; H01B3/47

Abstract:
A composite material structure that prevents a decrease in strength while interposing insulating resin portions between a conductive reinforced resin and a conductor, is provided. The composite material structure includes a conductive resin portion formed of an electrically conductive reinforced resin in which conductive fibers are contained in an insulating base material, a conductor which is formed of an electrically conductive material and a part of which is embedded in the conductive resin portion, and a plurality of layers of insulating resin portions which is layers of resin portions each including insulating fibers contained in an insulating base material, the plurality of layers of the insulating resin portions being embedded in the conductive resin portion so as to sandwich therebetween the at least the part of the conductor and so as to be interposed between the conductive fibers and the conductor.
Public/Granted literature
- US20220001633A1 COMPOSITE MATERIAL STRUCTURE AND COMPOSITE MATERIAL STRUCTURE PRODUCING METHOD Public/Granted day:2022-01-06
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