Invention Grant
- Patent Title: Sandwich panel molding method
-
Application No.: US18546030Application Date: 2021-10-11
-
Publication No.: US12076968B2Publication Date: 2024-09-03
- Inventor: Yukihiro Kamimura , Tomohiro Ito
- Applicant: The Yokohama Rubber Co., LTD.
- Applicant Address: JP Kanagawa
- Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Thorpe North & Western
- Priority: JP 21022230 2021.02.16
- International Application: PCT/JP2021/037513 2021.10.11
- International Announcement: WO2022/176261A 2022.08.25
- Date entered country: 2023-08-10
- Main IPC: B32B37/14
- IPC: B32B37/14 ; B32B5/18 ; B32B7/10 ; B32B7/12 ; B32B27/08 ; B32B27/28 ; B32B27/38 ; B32B37/06

Abstract:
A method of molding a sandwich panel includes a step of providing, on one or both surfaces of an (a) core material, a prepreg or the prepreg and an adhesive as a (b) skin material. The (a) core material is a super engineering plastic foam having a glass transition temperature of greater than 200° C. The (b) skin material contains: a (b-1) epoxy resin having an average molecular weight of 1300 or more or having a trishydroxymethane-type or cresol novolac-type structure and containing, in a total epoxy resin, an amount of 70 to 100 mass % of an epoxy resin that is semi-solid or solid; a (b-2) epoxy resin containing, in the total epoxy resin, an amount of 0 to 30 mass % of an epoxy resin that is liquid; and a (b-3) curing agent.
Public/Granted literature
- US20240034045A1 SANDWICH PANEL MOLDING METHOD Public/Granted day:2024-02-01
Information query