In order to thermally cure a thermosetting adhesive quickly and with less energy, the bonded article (10) according to the present invention comprises an adherend member (1) having a thermal conductivity of 1 w/m·K or more, an adherend member (2) made of a material which can adhere to the adherend member (1), and an adhesion portion that is formed of a cured product of a thermosetting adhesive (3) and that is in contact with both the adherend member (1) and the adherend member (2), wherein the adherend member (1) has a heat transfer-inhibiting structure (4) which inhibits the transfer of heat from a portion thereof in contact with the adhesive (3) to a peripheral portion thereof.