Invention Grant
- Patent Title: Liquid ejection head substrate, liquid ejection head, and method of manufacturing liquid ejection head substrate
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Application No.: US17892419Application Date: 2022-08-22
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Publication No.: US12076987B2Publication Date: 2024-09-03
- Inventor: Takeru Yasuda , Koichi Omata , Yuzuru Ishida
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: VENABLE LLP
- Priority: JP 21159098 2021.09.29
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.
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Information query
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