Invention Grant
- Patent Title: Substrate transfer apparatus and substrate transfer method
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Application No.: US17315423Application Date: 2021-05-10
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Publication No.: US12077392B2Publication Date: 2024-09-03
- Inventor: Hitoshi Hashima , Tohru Tochihara , Michiaki Matsushita , Hidekazu Kiyama
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 20083452 2020.05.11
- Main IPC: B65G47/90
- IPC: B65G47/90 ; G03F7/16 ; H01L21/677 ; H01L21/683 ; H01L21/687 ; H05K9/00
Abstract:
A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.
Public/Granted literature
- US20210347584A1 SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD Public/Granted day:2021-11-11
Information query
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