Invention Grant
- Patent Title: Resin composition
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Application No.: US17870818Application Date: 2022-07-21
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Publication No.: US12077667B2Publication Date: 2024-09-03
- Inventor: Te-Chao Liao , Chien Kai Wei , Hung-Yi Chang
- Applicant: NAN YA PLASTICS CORPORATION
- Applicant Address: TW Taipei
- Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Priority: TW 0144102 2021.11.26
- Main IPC: C08L75/04
- IPC: C08L75/04 ; C08L45/00
Abstract:
A resin composition includes resin and inorganic filler. The resin includes CE resin and BMI resin, and a purity of the inorganic filler is at least greater than 99%.
Public/Granted literature
- US20230167298A1 RESIN COMPOSITION Public/Granted day:2023-06-01
Information query
