Invention Grant
- Patent Title: CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
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Application No.: US17695022Application Date: 2022-03-15
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Publication No.: US12077681B2Publication Date: 2024-09-03
- Inventor: Ji Ho Lee , Young Gi Lee , Soo Yeon Sim , Hyun Woo Lee , Chang Suk Lee , Jong Won Lee
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20210035576 2021.03.18
- Main IPC: C09G1/04
- IPC: C09G1/04 ; B24B1/00 ; B24B37/04 ; C09G1/00 ; C09G1/02 ; C09G1/06 ; C09K3/14 ; C09K13/06 ; H01L21/306 ; B01J23/745 ; B82Y40/00 ; H01L21/304
Abstract:
A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition comprising a solvent; an abrasive agent; and a dendritic poly(amidoamine) containing a terminal functional group that has a pKa of about 6 or less.
Public/Granted literature
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