Invention Grant
- Patent Title: Temporary adhesive, temporary adhesive assembly, and method of processing substrate
-
Application No.: US17449410Application Date: 2021-09-29
-
Publication No.: US12077684B2Publication Date: 2024-09-03
- Inventor: Yaosen Wang , Xiaoyi Gao , Dongchen Ji
- Applicant: PhiChem Corporation
- Applicant Address: CN Shanghai
- Assignee: PhiChem Corporation
- Current Assignee: PhiChem Corporation
- Current Assignee Address: CN Shanghai
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: CN 2011057611.1 2020.09.29
- Main IPC: C09J171/00
- IPC: C09J171/00 ; C09J5/00 ; C09J163/00 ; C09J169/00 ; H01L21/56 ; H01L21/683

Abstract:
A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.
Public/Granted literature
- US20220098456A1 TEMPORARY ADHESIVE, TEMPORARY ADHESIVE ASSEMBLY, AND METHOD OF PROCESSING SUBSTRATE Public/Granted day:2022-03-31
Information query
IPC分类: