Invention Grant
- Patent Title: Variable cycle and time RF activation method for film thickness matching in a multi-station deposition system
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Application No.: US17587560Application Date: 2022-01-28
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Publication No.: US12077859B2Publication Date: 2024-09-03
- Inventor: Ishtak Karim , Kiyong Cho , Adrien LaVoie , Jaswinder Guliani , Purushottam Kumar , Jun Qian
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- The original application number of the division: US15143338 2016.04.29
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/52 ; C23C16/54
Abstract:
Methods and apparatuses for depositing approximately equal thicknesses of a material on at least two substrates concurrently processed in separate stations of a multi-station deposition apparatus are provided.
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