- Patent Title: Connector for substrate support with embedded temperature sensors
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Application No.: US17088546Application Date: 2020-11-03
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Publication No.: US12077862B2Publication Date: 2024-09-03
- Inventor: Siyuan Tian , Donald J. Miller
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- The original application number of the division: US15936990 2018.03.27
- Main IPC: C23C14/46
- IPC: C23C14/46 ; C23C16/458 ; C23C16/46 ; G01K7/00 ; H01L21/67 ; H05B3/02

Abstract:
An electrical connector includes first, second, third, and fourth electrical conductors. The first, second, third, and fourth electrical conductors each include a first end to be electrically connected to a respective electrically conductive pad formed on a surface of a ceramic layer of a substrate support and a second end to be electrically connected to a respective wire within a through hole in the substrate support. The electrical connector also includes a retainer to hold the first, second, third, and fourth electrical conductors in place.
Public/Granted literature
- US20210047732A1 CONNECTOR FOR SUBSTRATE SUPPORT WITH EMBEDDED TEMPERATURE SENSORS Public/Granted day:2021-02-18
Information query
IPC分类: