Invention Grant
- Patent Title: Film forming method and film forming apparatus
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Application No.: US17820929Application Date: 2022-08-19
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Publication No.: US12077865B2Publication Date: 2024-09-03
- Inventor: Hideki Yuasa , Hiroyuki Ikuta , Yutaka Fujino , Makoto Wada , Hirokazu Ueda
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP 21139582 2021.08.30
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/34 ; C23C16/56 ; H01J37/32

Abstract:
A film forming method of forming a film on a substrate by using a film forming apparatus including a processing container, and a stage provided in an interior of the processing container to place the substrate thereon and in which aluminum is contained, includes: forming a film continuously on one substrate or on a plurality of substrates by supplying a gas for film formation to the interior of the processing container while heating the substrate placed on the stage; cleaning the interior of the processing container with a fluorine-containing gas in a state in which the substrate is unloaded from the processing container; and performing a post-process by generating plasma of an oxygen- and hydrogen-containing-gas in the interior of the processing container, wherein the forming the film, the cleaning the interior of the processing container, and the performing the post-process are repeatedly performed.
Public/Granted literature
- US20230061151A1 FILM FORMING METHOD AND FILM FORMING APPARATUS Public/Granted day:2023-03-02
Information query
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