Invention Grant
- Patent Title: Liquid-cooling heat dissipation device
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Application No.: US16853701Application Date: 2020-04-20
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Publication No.: US12078190B2Publication Date: 2024-09-03
- Inventor: Tsung-Wei Lin , Shui-Fa Tsai
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Maschoff Brennan
- Priority: TW 8215769 2019.11.27
- Main IPC: F04D29/58
- IPC: F04D29/58 ; H05K7/20
Abstract:
A liquid-cooling heat dissipation device including a base and two pumps. The base has a first inlet and a first outlet. The two pumps are disposed on the base and connected to the first inlet and the first outlet in a parallel arrangement.
Public/Granted literature
- US20210156399A1 LIQUID-COOLING HEAT DISSIPATION DEVICE Public/Granted day:2021-05-27
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