Invention Grant
- Patent Title: Thermopile-based flow sensing device
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Application No.: US18352767Application Date: 2023-07-14
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Publication No.: US12078519B2Publication Date: 2024-09-03
- Inventor: Robert Higashi , Scott Edward Beck , Yong-Fa Wang , Ian Bentley , Bill Hoover
- Applicant: Honeywell International Inc.
- Applicant Address: US NC Charlotte
- Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee Address: US NC Charlotte
- Agency: Alston & Bird LLP
- The original application number of the division: US16992411 2020.08.13
- Main IPC: G01F1/688
- IPC: G01F1/688 ; G01F1/684 ; H10N10/851 ; H10N19/00

Abstract:
Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
Public/Granted literature
- US20230358586A1 THERMOPILE-BASED FLOW SENSING DEVICE Public/Granted day:2023-11-09
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