Invention Grant
- Patent Title: Temperature protection circuit
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Application No.: US17402796Application Date: 2021-08-16
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Publication No.: US12078554B2Publication Date: 2024-09-03
- Inventor: Chan-Hong Chern , Kun-Lung Chen , Ming Hsien Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: G01K7/18
- IPC: G01K7/18 ; G01K7/01 ; G01K7/25 ; G01R1/20 ; G01R19/00 ; G01R27/02 ; G01R27/08 ; G01R27/14 ; H01L21/66

Abstract:
A circuit includes a temperature-sensitive voltage divider. The temperature-sensitive voltage divider includes a temperature-sensitive resistor and a second resistor having a first terminal coupled to a first terminal of the temperature-sensitive resistor. A temperature signal is generated at a first node coupled to the first terminal of the temperature-sensitive resistor. Detection logic is coupled to the first node to generate a detection signal responsive to the temperature signal.
Public/Granted literature
- US20210372859A1 TEMPERATURE PROTECTION CIRCUIT Public/Granted day:2021-12-02
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