Invention Grant
- Patent Title: Optical phased array structure and fabrication techniques
-
Application No.: US17754358Application Date: 2020-10-05
-
Publication No.: US12078911B2Publication Date: 2024-09-03
- Inventor: Hui Wu
- Applicant: University of Rochester
- Applicant Address: US NY Rochester
- Assignee: UNIVERSITY OF ROCHESTER
- Current Assignee: UNIVERSITY OF ROCHESTER
- Current Assignee Address: US NY Rochester
- Agency: Kalos Athena Wang PLLC
- Agent Ping Wang
- International Application: PCT/US2020/054210 2020.10.05
- International Announcement: WO2021/067911A 2021.04.08
- Date entered country: 2022-03-30
- Main IPC: G02F1/295
- IPC: G02F1/295 ; G01S7/481

Abstract:
Methods of manufacturing and operating a monolithically integrated optical phase array (OPA) chip device, and the device itself. A three-dimensional (3-D) integrated optical phase array (OPA) chip device. A system of complementary metal-oxide-semiconductor (CMOS) electronics integrated with a three-dimensional integrated optical array chip device. A method of three-dimension photonic integration to improve optical power in optical phase arrays.
Public/Granted literature
- US20220334451A1 OPTICAL PHASED ARRAY STRUCTURE AND FABRICATION TECHNIQUES Public/Granted day:2022-10-20
Information query