Invention Grant
- Patent Title: Photosensitive resin composition, pattern forming method, cured film, laminate, and device
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Application No.: US17336335Application Date: 2021-06-02
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Publication No.: US12078929B2Publication Date: 2024-09-03
- Inventor: Toshihide Aoshima , Kenta Yamazaki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 18228557 2018.12.05
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/029 ; G03F7/031 ; G03F7/032 ; G03F7/037 ; G03F7/038 ; G03F7/11 ; G03F7/20 ; G03F7/32 ; G03F7/40

Abstract:
There are provided a photosensitive resin composition containing at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, a compound having a sulfurous ester structure, and a photoradical polymerization initiator, and satisfies at least one of the following conditions 1, . . . , or 3; a pattern forming method using a photosensitive film formed from the photosensitive resin composition; a cured film formed from the photosensitive resin composition; a laminate including the cured film; and a device having the cured film or the laminate.
the condition 1: the precursor contains a radically polymerizable group,
the condition 2: the compound having a sulfurous ester structure contains a radically polymerizable group, and
the condition 3: the photosensitive resin composition further contains a compound containing a radically polymerizable group, other than the precursor and the compound having a sulfurous ester structure.
the condition 1: the precursor contains a radically polymerizable group,
the condition 2: the compound having a sulfurous ester structure contains a radically polymerizable group, and
the condition 3: the photosensitive resin composition further contains a compound containing a radically polymerizable group, other than the precursor and the compound having a sulfurous ester structure.
Public/Granted literature
- US20210302835A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE Public/Granted day:2021-09-30
Information query
IPC分类: