Invention Grant
- Patent Title: X-ray sensitive materials for data protection
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Application No.: US17189857Application Date: 2021-03-02
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Publication No.: US12079377B2Publication Date: 2024-09-03
- Inventor: Eric J. Campbell , Matthew Doyle , Mark J. Jeanson , Gerald Bartley , Darryl Becker
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Kelsey M. Skodje
- Main IPC: G06F21/72
- IPC: G06F21/72 ; C01G5/02 ; C09D7/61 ; C09K5/14 ; G01J1/42 ; G01R31/00 ; G01R31/28 ; G01T1/17 ; H01L23/00 ; H05K1/02 ; H05K1/18

Abstract:
A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.
Public/Granted literature
- US20220284131A1 X-RAY SENSITIVE MATERIALS FOR DATA PROTECTION Public/Granted day:2022-09-08
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