Invention Grant
- Patent Title: Bundle multiple timing parameters for fast SLC programming
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Application No.: US17901310Application Date: 2022-09-01
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Publication No.: US12079496B2Publication Date: 2024-09-03
- Inventor: Chin-Yi Chen , Muhammad Masuduzzaman , Xiang Yang
- Applicant: SanDisk Technologies LLC
- Applicant Address: US TX Addison
- Assignee: SanDisk Technologies LLC
- Current Assignee: SanDisk Technologies LLC
- Current Assignee Address: US TX Addison
- Agency: Vierra Magen Marcus LLP
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
Technology is disclosed herein for managing timing parameters when programming memory cells. Timing parameters used sub-clocks in an MLC program mode may also be used for those same sub-clocks in a first SLC program mode. However, in a second SLC program mode a different set of timing parameters may be used for that set of sub-clocks. Using the same set of timing parameters for the MLC program mode and the first SLC program mode saves storage space. However, the timing parameters for the MLC program mode may be slower than desired for SLC programming. A different set of timing parameters may be used for the second SLC program mode to provide for faster program operation. Moreover, the different set of timing parameters used for the faster SLC program mode do not require storage of a separate set of timing parameters.
Public/Granted literature
- US20240078028A1 BUNDLE MULTIPLE TIMING PARAMETERS FOR FAST SLC PROGRAMMING Public/Granted day:2024-03-07
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