Invention Grant
- Patent Title: Card-type information substrate including a frame
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Application No.: US17768782Application Date: 2019-10-18
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Publication No.: US12079682B2Publication Date: 2024-09-03
- Inventor: Yean Wei Yeap , Wen Qiang Chin , Minli Cindy Ng
- Applicant: LINXENS HOLDING
- Applicant Address: FR Mantes-la-Jolie
- Assignee: LINXENS HOLDING
- Current Assignee: LINXENS HOLDING
- Current Assignee Address: FR Mantes-la-Jolie
- Agency: DITTHAVONG, STEINER, & MLOTKOWSKI
- International Application: PCT/IB2019/001183 2019.10.18
- International Announcement: WO2021/074658A 2021.04.22
- Date entered country: 2022-04-13
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077

Abstract:
The present invention relates to card-type information substrates, such as payment cards, in which a frame is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.
Public/Granted literature
- US20230145739A1 CARD-TYPE INFORMATION SUBSTRATE INCLUDING A FRAME Public/Granted day:2023-05-11
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