Invention Grant
- Patent Title: Haptic providing device and method for converting sound signal to haptic signal
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Application No.: US18330388Application Date: 2023-06-07
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Publication No.: US12080155B2Publication Date: 2024-09-03
- Inventor: Hyeong Jun Kim , Jong Hun Lee , In Sik Jee
- Applicant: CK MATERIALS LAB CO., LTD.
- Applicant Address: KR Seoul
- Assignee: CK MATERIALS LAB CO., LTD.
- Current Assignee: CK MATERIALS LAB CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: NKL Law
- Agent Jae Youn Kim
- Priority: KR 20190021216 2019.02.22 KR 20190021217 2019.02.22
- Main IPC: G06F3/16
- IPC: G06F3/16 ; G06F3/01 ; G08B6/00 ; G10L21/06 ; H04R3/00 ; H04S7/00
Abstract:
Provided is a haptic device including a medium for receiving a digital sound signal from a portable terminal, a digital-to-analog converter (DAC) for receiving the digital sound signal from the medium and converting the digital sound signal into an analog signal, a sound outputter for receiving the analog signal and outputting sound, and a haptic actuator driven by receiving the analog signal.
Public/Granted literature
- US20230316881A1 HAPTIC PROVIDING DEVICE AND METHOD FOR CONVERTING SOUND SIGNAL TO HAPTIC SIGNAL Public/Granted day:2023-10-05
Information query
