Invention Grant
- Patent Title: Method to form an inductive component
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Application No.: US18242554Application Date: 2023-09-06
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Publication No.: US12080472B2Publication Date: 2024-09-03
- Inventor: Pei-I Wei , Cheng-Hao Chang , Shing Tak Li
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agent Min-Lee Teng
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/02 ; H01F27/02 ; H01F27/28 ; H01F41/00 ; H05K1/18

Abstract:
A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.
Public/Granted literature
- US20240006116A1 METHOD TO FORM AN INDUCTIVE COMPONENT Public/Granted day:2024-01-04
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