Invention Grant
- Patent Title: Bonding method, bonding device, and holding member
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Application No.: US17225727Application Date: 2021-04-08
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Publication No.: US12080554B2Publication Date: 2024-09-03
- Inventor: Hajime Mitsuishi , Isao Sugaya , Minoru Fukuda , Masaki Tsunoda , Hidehiro Maeda , Ikuhiro Kuwano
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: STAAS & HALSEY LLP
- Priority: JP 16223645 2016.11.16
- The original application number of the division: US16413127 2019.05.15
- Main IPC: H01L21/18
- IPC: H01L21/18 ; B23K20/00 ; H01L21/02 ; H01L21/50 ; H01L21/67 ; H01L21/68 ; H01L21/683 ; H01L21/687
Abstract:
A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
Public/Granted literature
- US20210225651A1 BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER Public/Granted day:2021-07-22
Information query
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