Invention Grant
- Patent Title: Fin field-effect transistor and method of forming the same
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Application No.: US18344554Application Date: 2023-06-29
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Publication No.: US12080556B2Publication Date: 2024-09-03
- Inventor: Tzu Ang Chiang , Ming-Hsi Yeh , Chun-Neng Lin , Jian-Jou Lian , Po-Yuan Wang , Chieh-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/311 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a semiconductor fin. The semiconductor device includes a metal gate disposed over the semiconductor fin. The semiconductor device includes a gate dielectric layer disposed between the semiconductor fin and the metal gate. The semiconductor device includes first spacers sandwiching the metal gate. The first spacers have a first top surface and the gate dielectric layer has a second top surface, and the first top surface and a first portion of the second top surface are coplanar with each other. The semiconductor device includes second spacers further sandwiching the first spacers. The second spacers have a third top surface above the first top surface and the second top surface. The semiconductor device includes a gate electrode disposed over the metal gate.
Public/Granted literature
- US20230352306A1 FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME Public/Granted day:2023-11-02
Information query
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