Invention Grant
- Patent Title: Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus
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Application No.: US17100944Application Date: 2020-11-23
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Publication No.: US12080609B2Publication Date: 2024-09-03
- Inventor: Hung-Jui Kuo , Hui-Jung Tsai , Chih Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- The original application number of the division: US16655240 2019.10.17
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01N27/00 ; H01L21/02 ; H01L21/027 ; H01L21/033 ; H01L21/311
Abstract:
Provided is a method of detecting photoresist scums and photoresist residues. A carrier is provided. The carrier has a photoresist layer with opening patterns therein. A plasma etching process is performed to the opening patterns of the photoresist layer. Charges are injected to the opening patterns of the photoresist layer. Whether a photoresist scum or residue is present in at least one of the opening patterns is detected.
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