The invention discloses a thermal management device for high heat flux application in a microelectronic device comprising an integrated board, a microelectronic chip, a thermal interface materials component, a microchannel heat sink assembly operatively connected to the thermal interface materials component, for heat dissipation from the integrated board and the microelectronic chip to the thermal interface materials component, wherein the microchannel heat sink assembly comprises a housing and an adiabatic wall configured to allow heat to pass across the microchannel heat sink assembly. The microchannel heat sink assembly is a four-compartment microchannel heat sink assembly with symmetrical areas.