The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including a dense pattern area and a loose pattern area positioned adjacent to the dense pattern area; a plurality of dense conductive layers positioned on the dense pattern area of the substrate; and a plurality of loose conductive layers positioned on the loose pattern area of the substrate. A distance between an adjacent pair of the plurality of dense conductive layers is less than a distance between an adjacent pair of the plurality of loose conductive layers.