Invention Grant
- Patent Title: Flexible circuit board and chip package including same
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Application No.: US18197245Application Date: 2023-05-15
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Publication No.: US12080654B2Publication Date: 2024-09-03
- Inventor: Jun Young Lim , Hyung Kyu Yoon , Sung Min Chae
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR 20170145443 2017.11.02
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/498 ; H01L25/16 ; H01L25/18

Abstract:
A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
Public/Granted literature
- US20230282590A1 FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME Public/Granted day:2023-09-07
Information query
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