A multi-layered structure interface between a ball grid array (BGA) device and a printed circuit board (PCB), including a ball guide layer comprising a through hole; a first elastomeric portion of a first layer in superimposition with at least a portion of the through hole, the first elastomeric portion having a first width; and a second elastomeric portion of a second layer having a second width; wherein first elastomeric portion is positioned between the through hole of the ball guide layer and the second elastomeric portion, wherein the first width of the first elastomeric portion is greater than the second width of the second elastomeric portion.