Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18353907Application Date: 2023-07-18
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Publication No.: US12080707B2Publication Date: 2024-09-03
- Inventor: Tatsuya Naito
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 16047188 2016.03.10 JP 16201972 2016.10.13 JP 17024925 2017.02.14
- The original application number of the division: US15900810 2018.02.21
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/76 ; H01L21/765 ; H01L27/06 ; H01L27/07 ; H01L29/08 ; H01L29/10 ; H01L29/32 ; H01L29/36 ; H01L29/40 ; H01L29/423 ; H01L29/739 ; H01L29/78 ; H01L29/861

Abstract:
A semiconductor device includes a semiconductor substrate having a first conductivity type drift region and a second conductivity type base region above the drift region, trench portions at an upper surface of the semiconductor substrate arrayed parallel to one another, each of them penetrating the base region, and mesa portions between respective trench portions. Among the mesa portions, at least one mesa portion includes a first conductivity type first semiconductor region having a higher concentration than the drift region, a second conductivity type second semiconductor region having a higher concentration than the base region, and a first conductivity type accumulation region between the base and drift regions and has a higher concentration than the drift region. The drift region does not extend above the accumulation region. In a longitudinal direction of the trench portions, the accumulation region extends beyond an end portion of the first semiconductor region.
Public/Granted literature
- US20230361111A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-11-09
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