Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17546254Application Date: 2021-12-09
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Publication No.: US12080764B2Publication Date: 2024-09-03
- Inventor: Chih-Yen Chen , Franky Juanda Lumbantoruan , Tuan-Wei Wang , Juin-Yang Chen
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/205 ; H01L29/267 ; H01L29/778 ; H01L29/20

Abstract:
A semiconductor structure includes a substrate, a buffer layer, a channel layer, a barrier layer, a doped compound semiconductor layer, and a composite blocking layer. The buffer layer is on the substrate. The channel layer is on the buffer layer. The barrier layer is on the channel layer. The doped compound semiconductor layer is on the barrier layer. The composite blocking layer is on the doped compound semiconductor layer, the composite blocking layer and the barrier layer include the same Group III element, and the atomic percent of the same Group III element in the composite blocking layer increases with the distance from the doped compound semiconductor layer.
Public/Granted literature
- US20230187505A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2023-06-15
Information query
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