Invention Grant
- Patent Title: Fast recovery diode and manufacturing method thereof
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Application No.: US17296045Application Date: 2019-11-15
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Publication No.: US12080806B2Publication Date: 2024-09-03
- Inventor: Xiuguang Xiao , Wei Zhang
- Applicant: BYD SEMICONDUCTOR COMPANY LIMITED
- Applicant Address: CN Shenzhen
- Assignee: BYD SEMICONDUCTOR COMPANY LIMITED
- Current Assignee: BYD SEMICONDUCTOR COMPANY LIMITED
- Current Assignee Address: CN Shenzhen
- Agent Wenye Tan
- Priority: CN 1811388533.6 2018.11.21
- International Application: PCT/CN2019/118786 2019.11.15
- International Announcement: WO2020/103770A 2020.05.28
- Date entered country: 2021-11-12
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/66 ; H01L29/861

Abstract:
A fast recovery diode includes a cell region, a main junction region arranged around the cell region, and a termination region arranged around the main junction region. A main junction doping region in the main junction region has a doping concentration lower than that of an active region in the cell region. The doping concentration of the main junction doping region gradually decreases along a direction from inside to outside.
Public/Granted literature
- US20220059707A1 FAST RECOVERY DIODE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-02-24
Information query
IPC分类: