Invention Grant
- Patent Title: Connection module
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Application No.: US17290890Application Date: 2019-11-01
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Publication No.: US12080914B2Publication Date: 2024-09-03
- Inventor: Hideo Takahashi , Shinichi Takase , Hiroki Shimoda , Hideaki Nakajima
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 18219301 2018.11.22
- International Application: PCT/JP2019/043016 2019.11.01
- International Announcement: WO2020/105399A 2020.05.28
- Date entered country: 2021-05-03
- Main IPC: H01M50/507
- IPC: H01M50/507 ; H01M50/50 ; H01M50/502 ; H01M50/519

Abstract:
A connection module includes an FPC and a plurality of bus bars. The plurality of bus bars constitute a first bus bar row disposed along one long side of the FPC, and a second bus bar row disposed along the other long side of the FPC. The FPC includes tolerance absorbing portions each including a slit and a pair of deflection portions disposed with the slit interposed therebetween, and is divided into a plurality of wiring portion by the tolerance absorbing portions. The pair of deflection portions constituting the first tolerance absorbing portion can be deflected in a direction in which the two wiring portions that are adjacent to each other with the first tolerance absorbing portion interposed therebetween move toward and away from each other. The same description also applies to the second tolerance absorbing portion.
Public/Granted literature
- US20220006159A1 CONNECTION MODULE Public/Granted day:2022-01-06
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