A semiconductor module includes first and second switching devices and first and second control devices all sealed in a package rectangular in a plan view, signal terminals on a side surface of a first long side input signals to the first and second control devices, each of the first and second switching devices outputs one of the signals from an output terminal on a side surface of a second long side, each of the first and second control devices includes a control ground connected to a control ground terminal on the side surface of the first long side, a main power terminal and a power ground terminal are disposed on the side surface of the second long side, and the power ground terminal is electrically connected inside the package to the control ground terminal through a current detection resistor outside the package and an impedance component inside the package.