A camera module structure is provided which includes a mainboard, a first camera module, a second camera module, and a TOF device. The TOF device is located between the first camera module and the second camera module, which are respectively mounted to a first mounting portion and a second mounting portion that are hollowed-out via the brackets. The mainboard includes a spacing portion for separation between the first mounting portion and the second mounting portion. The TOF device is disposed on an upper surface of an auxiliary circuit board; the auxiliary circuit board is greater than the spacing portion in width; the auxiliary circuit board is located on an upper surface of the mainboard, and the auxiliary circuit board is connected to the mainboard and at least partially overlapped with the spacing portion; and the auxiliary circuit board is provided with a material removal portion on a lower surface.