Invention Grant
- Patent Title: Superconducting flex circuit boards having metal structures for improved interfacing characteristics
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Application No.: US17476612Application Date: 2021-09-16
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Publication No.: US12082335B2Publication Date: 2024-09-03
- Inventor: John Martinis , Xiaojun Trent Huang , Bob Benjamin Buckley
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: GOOGLE LLC
- Current Assignee: GOOGLE LLC
- Current Assignee Address: US CA Mountain View
- Agency: DORITY & MANNING P.A.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G06N10/00 ; H03K5/01 ; H05K1/09 ; H05K1/11 ; H05K3/06 ; H05K3/18

Abstract:
A flex circuit board can be used in transmitting signals in a quantum computing system. The flex circuit board can include at least one dielectric layer and at least one superconducting layer disposed on a surface of the at least one dielectric layer. The at least one superconducting layer can include a superconducting material. The superconducting material can be superconducting at a temperature less than about 3 kelvin. The flex circuit board can have at least one metal structure electroplated onto the at least one superconducting layer.
Public/Granted literature
- US20220087012A1 Superconducting Flex Circuit Boards Having Metal Structures For Improved Interfacing Characteristics Public/Granted day:2022-03-17
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