An apparatus or system can act as a cooling device configured for cooling a plurality of high-power electronic components mounted on a circuit board. The apparatus includes a plurality of cooling plate assemblies, the cooling plate assemblies each including a cooling plate for mating to one of the high-power electronic components and an enclosure mounted to the cooling plate for defining a coolant transport path over at least part of a surface thereof. The apparatus further includes one or more flexible conduits that connect between the cooling plate assemblies for fluid communication between their respective coolant transport paths.