Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17899962Application Date: 2022-08-31
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Publication No.: US12082387B2Publication Date: 2024-09-03
- Inventor: Yuki Inuzuka
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP 22043864 2022.03.18
- Main IPC: G11C16/10
- IPC: G11C16/10 ; G11C16/04 ; H10B43/27

Abstract:
A semiconductor device includes a plurality of conductive layers stacked above one another in a first direction and including a first conductive layer, second conductive layers, and third conductive layers, a semiconductor film extending in the first direction through the conductive layers, an insulating film around the semiconductor film between the semiconductor film and the plurality of conductive layers. During a program operation performed on a first memory cell, a program voltage is applied to the first conductive layer while a first voltage is applied to the second conductive layers and a second voltage different from the first voltage is applied to the third conductive layers. The second conductive layers are each connected to gates of second memory cells programmed to store m bits, and the third conductive layers are each connected to gates of third memory cells programmed to store n bits, where n is different from m.
Public/Granted literature
- US20230301093A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-09-21
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